In a particular embodiment, a circuit device includes a first die coupled to a circuit substrate and having a substantially planar surface. The first die includes electrical contacts distributed on the substantially planar surface adjacent to at least three edges of the first die. The circuit device further includes a second die attached to the substantially planar surface of the first die. The second die is rotated by an offset angle about an axis relative to the first die. The offset angle is selected to allow horizontal and vertical access to the electrical contacts.