07855445 is referenced by 25 patents and cites 14 patents.

In a particular embodiment, a circuit device includes a first die coupled to a circuit substrate and having a substantially planar surface. The first die includes electrical contacts distributed on the substantially planar surface adjacent to at least three edges of the first die. The circuit device further includes a second die attached to the substantially planar surface of the first die. The second die is rotated by an offset angle about an axis relative to the first die. The offset angle is selected to allow horizontal and vertical access to the electrical contacts.

Title
Circuit device including rotated stacked die
Application Number
12/111341
Publication Number
7855445 (B2)
Application Date
April 29, 2008
Publication Date
December 21, 2010
Inventor
Richard Webb
Austin
TX, US
D Matthew Landry
Austin
TX, US
Agent
R Michael Reed
Polansky & Associates P L L C
Assignee
Silicon Laboratories
TX, US
IPC
H01L 23/02
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