07799611 is referenced by 23 patents and cites 72 patents.

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is disclosed, wherein the method lends itself to better automation of the manufacturing line as well as to improving the quality and reliability of the packages produced therefrom. This is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal formed into a web-like lead frame on one side, in contrast with the conventional fully etched stencil-like lead frames, so that the web-like lead frame, which is solid and flat on the other side is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation without having to cut into any additional metal. The use of the instant partially patterned lead frame in making ELP, ELPF and ELGA-type CSPs is also disclosed.

Title
Partially patterned lead frames and methods of making and using the same in semiconductor packaging
Application Number
11/553664
Publication Number
7799611 (B2)
Application Date
October 27, 2006
Publication Date
September 21, 2010
Inventor
Anang Subagio
Batam Island
ID
Romarico Santos San Antonio
Batam Island
ID
Mary Jean Ramos
Alessandrea
SG
Agent
White & Case
Assignee
Unisem
MU
IPC
H01L 21/00
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