07795710 is referenced by 9 patents and cites 15 patents.

A redistributed lead frame for use in molded plastic semiconductor package (38) is formed from an electrically conductive substrate by a sequential metal removal process. The process includes: (a) patterning a first side of an electrically conductive substrate to form an array of lands separated by channels, (b) disposing a first molding compound (18) within these channels, (c) patterning a second side of the electrically conductive substrate to form an array of chip attach sites (24) and routing circuits (26) electrically interconnecting the array of lands and the array of chip attached sites (24), (d) directly electrically interconnecting input/output pads on the at least one semiconductor device (28) to chip attach site members (24) of the array of chip attach sites (24), and (e) encapsulating the at least one semiconductor device (28), the array of chip attach sites (24) and the routing circuits (26) with a second molding compound (36). This process is particularly suited for the manufacture of chip scale packages and very thin packages.

Title
Lead frame routed chip pads for semiconductor packages
Application Number
10/561381
Publication Number
7795710 (B2)
Application Date
June 18, 2004
Publication Date
September 14, 2010
Inventor
Anang Subagio
Batam Island
ID
Romarico Santos San Antonio
Batam Island
ID
Shafidul Islam
Plano
TX, US
Agent
Wiggin and Dana
Assignee
Unisem
MU
IPC
H01L 23/495
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