07762472 is referenced by 13 patents and cites 224 patents.

An article package formed from, for example, an aluminum-evaporated laminated film includes a cut-out section, which has no aluminum-evaporated layer, in an edge. An electromagnetic-coupling module is disposed in the cut-out section. A wireless IC device is constituted by the electromagnetic-coupling module and an aluminum-evaporated layer of the package. A magnetic-field antenna of the electromagnetic-coupling module is coupled to the aluminum-evaporated layer of the package. The whole of the article package acts as a radiator of the antenna.

Title
Wireless IC device
Application Number
11/964185
Publication Number
7762472 (B2)
Application Date
December 26, 2007
Publication Date
July 27, 2010
Inventor
Noboru Kato
Moriyama
JP
Agent
Keating & Bennett
Assignee
Murata Manufacturing
JP
IPC
G06K 19/06
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