07759782 is referenced by 20 patents and cites 21 patents.

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.

Title
Substrate for a microelectronic package and method of fabricating thereof
Application Number
11/400665
Publication Number
7759782 (B2)
Application Date
April 7, 2006
Publication Date
July 20, 2010
Inventor
Apolinar Alvarez Jr
Fremont
CA, US
Craig S Mitchell
San Jose
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 29/40
H01L 23/52
H01L 23/48
H01L 23/29
H01L 23/34
H01L 23/02
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