07741158 is referenced by 55 patents and cites 14 patents.

An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive vias and a centrally disposed aperture extending from the first side to the second side. A heat slug has a mid portion extending through the aperture, a first portion adjacent the first side of the substrate with a cross sectional area larger than the cross sectional area of the aperture and an opposing second portion adjacent the second side of the substrate. One or more semiconductor devices are bonded to the first portion of the heat slug and electrically interconnected to the electrically conductive vias. A heat spreader having a first side and an opposing second side is spaced from the semiconductor devices and generally parallel with the heat slug, whereby the semiconductor devices are disposed between the heat spreader and the heat slug. A molding resin encapsulates the semiconductor devices and at least the first side of the substrate, the first portion of the heat slug and the first side of the heat spreader.

Title
Method of making thermally enhanced substrate-base package
Application Number
11/807650
Publication Number
7741158 (B2)
Application Date
May 30, 2007
Publication Date
June 22, 2010
Inventor
Anang Subagio
Batam Island
ID
Romarico Santos San Antonio
Batam Island
ID
Kyaw Ko Lwin
Singapore
SG
Gan Kian Yeow
Singapore
SG
Mary Jean Bajacan Ramos
Alessandrea
SG
Timothy Leung
Singapore
SG
Agent
Wiggin and Dana
Assignee
Unisem
MU
IPC
H05K 7/20
H01L 23/34
H01L 21/00
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