07723850 is referenced by 9 patents and cites 58 patents.

A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.

Title
Electronic devices having air gaps
Application Number
11/891857
Publication Number
7723850 (B2)
Application Date
August 13, 2007
Publication Date
May 25, 2010
Inventor
Jeffrey M Calvert
Acton
MA, US
Timothy G Adams
Sudbury
MA, US
Dana A Gronbeck
Holliston
MA, US
Michael K Gallagher
Hopkinton
MA, US
Agent
Jonathan D Baskin
Assignee
Rohm and Haas Electronic Materials
MA, US
IPC
H01L 31/112
H01L 29/80
H01L 29/74
H01L 29/73
H01L 27/10
H01L 29/40
H01L 23/52
H01L 23/48
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