07714431 is referenced by 50 patents and cites 429 patents.

A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.

Title
Electronic component package comprising fan-out and fan-in traces
Application Number
11/605740
Publication Number
7714431 (B1)
Application Date
November 28, 2006
Publication Date
May 11, 2010
Inventor
David Razu
Gilbert
AZ, US
Sukianto Rusli
Phoenix
AZ, US
Ronald Patrick Huemoeller
Chandler
AZ, US
Agent
Serge J Hodgson
Gunnison McKay & Hodgson L
Assignee
Amkor Technology
AZ, US
IPC
H01L 23/12
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