07713840 is referenced by 4 patents and cites 23 patents.

A semiconductor body selected from the group consisting of a semiconductor layer, a semiconductor layer sequence or a semiconductor layer structure. The semiconductor body is transferred from a growth substrate to a support material by: exposing an interface between the growth substrate and the semiconductor body or a region in the vicinity of said interface to electromagnetic radiation through one of the semiconductor body and the growth substrate; decomposing a material at or in proximity to said interface by absorption of the electromagnetic radiation in proximity to or at said interface so that the semiconductor body can be separated from the growth substrate; and connecting the semiconductor body to the support material.

Title
Electronic components produced by a method of separating two layers of material from one another
Application Number
12/75599
Publication Number
7713840 (B2)
Application Date
March 11, 2008
Publication Date
May 11, 2010
Inventor
Robert Handschuh
Garching/Alz
DE
Roman Dimitrov
München
DE
Martin Brandt
München
DE
Martin Stutzmann
Erding
DE
Oliver Ambacher
Neufahrn
DE
Michael Kelly
Freising
DE
Agent
Cohen Pontani Lieberman & Pavane
Assignee
Osram
DE
IPC
H01L 21/00
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