07703201 is referenced by 9 patents and cites 7 patents.

A method for embedding tamper proof layers and discrete components into a printed circuit board stack-up is disclosed. According to this method, a plating mask is applied on a base substrate to cover partially one of its faces. Conductive ink is then spread on this face so as to fill the gap formed by the plating mask. To obtain a uniform distribution of the conductive ink and then gel it, the conductive ink is preferably heated. A dielectric layer is applied on the conductive ink layer and the polymerization process is ended to obtain a strong adhesion between these two layers. In a preferred embodiment, conductive tracks are simultaneously designed on the other face of the base substrate to reduce thermo-mechanical strains and deformations.

Title
Method of embedding tamper proof layers and discrete components into printed circuit board stack-up
Application Number
11/163609
Publication Number
7703201 (B2)
Application Date
October 25, 2005
Publication Date
April 27, 2010
Inventor
Tamas Visegrady
Zurich
CH
Kevin C Gotze
Poughkeepsie
NY, US
Nihad Hadzic
Wappingers Falls
NY, US
Vincenzo Condorelli
Poughkeepsie
NY, US
Stefano Sergio Oggioni
Milan
IT
Agent
Joseph Petrokaitis
Steve Capella
Assignee
International Business Machines Corporation
NY, US
IPC
H01K 3/00
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