07700414 is referenced by 10 patents and cites 14 patents.

A method for the manufacture of a package to encapsulate at least one integrated circuit device includes the steps of: (1) providing a dielectric substrate having a first plurality of bond pads formed on a first side thereof and at least one aperture; (2) electrically interconnecting the integrated circuit device to the plurality of bond pads forming a substrate/integrated circuit device assembly; (3) gravitationally aligning the substrate/integrated circuit assembly such that the integrated circuit device is lower than said substrate; (4) introducing a volume of a low viscosity dielectric into the at least one aperture, wherein the volume is effective to coat a surface of the integrated circuit device and substantially fill the at least one aperture; and (5) encapsulating the integrated circuit device and the first side of said substrate with a dielectric polymer.

Title
Method of making flip-chip package with underfill
Application Number
11/709403
Publication Number
7700414 (B1)
Application Date
February 22, 2007
Publication Date
April 20, 2010
Inventor
Mary Jean Bajacan Ramos
Alessandrea
SG
Glenn Macaraeg
Graz
AT
Anang Subagio
Batam Island
ID
Romarico Santos San Antonio
Batam Island
ID
Agent
Wiggin and Dana
Assignee
Unisem
MU
IPC
H01L 21/44
H01L 21/46
H01L 21/00
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