07696006 is referenced by 16 patents and cites 19 patents.

Composite flip-chip with encased components and method of fabricating the same is described. One aspect of the invention relates to fabricating composite flip-chip packages for integrated circuit dice. Interposing substrates are formed. At least one discrete component is attached to a bottom surface of each of the interposing substrates. A first array of solder balls is placed on the bottom surface of each of the interposing substrates. The interposing substrates are mounted to a carrier strip. The integrated circuit dice are attached to top surfaces of the interposing substrates. The integrated circuit dice and the interposing substrates are encapsulated in molding compound to define flip-chip assemblies.

Title
Composite flip-chip package with encased components and method of fabricating same
Application Number
12/98053
Publication Number
7696006 (B1)
Application Date
April 4, 2008
Publication Date
April 13, 2010
Inventor
Paul Ying Fung Wu
Saratoga
CA, US
Lan H Hoang
Fremont
CA, US
Agent
Lois D Cartier
Robert M Brush
Assignee
Xilinx
CA, US
IPC
H01L 21/50
H01L 21/48
H01L 21/44
View Original Source