07670921 is referenced by 22 patents and cites 22 patents.

A method of forming a metal-insulator-metal (MIM) capacitor includes forming a first planar dielectric layer with a first metallization layer therein; forming a first passivation layer on top thereof; forming a planar conductive layer above the first passivation layer; patterning and selectively removing the conductive layer up to the first passivation layer in designated areas to form a set of conductive features; patterning and conformally coating the set of conductive features and the exposed first passivation layer with a high strength dielectric coating; disposing a second dielectric layer above the first passivation layer and enclosing the set of conductive features; patterning and selectively removing portions of the second substrate to form channels and trenches; performing a dual-Damascene process to form a second metallization layer in the trenches and channels and to form an upper conductive surface above the high strength dielectric coating.

Title
Structure and method for self aligned vertical plate capacitor
Application Number
11/616955
Publication Number
7670921 (B2)
Application Date
December 28, 2006
Publication Date
March 2, 2010
Inventor
Richard P Volant
New Fairfield
CT, US
Anthony K Stamper
Williston
VT, US
Jeffrey P Gambino
Westford
VT, US
Ebenezer E Eshun
Newburgh
NY, US
Timothy J Dalton
Ridgefield
CT, US
Douglas D Coolbaugh
Essex Junction
VT, US
Anil K Chinthakindi
Haymarket
VA, US
Agent
Katherine Brown
Cantor Colburn
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 21/4763
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