07655502 is referenced by 40 patents and cites 56 patents.

A method of packaging a first device having a first major surface and a second major surface includes forming a first layer over a second major surface of the first device and around sides of the first device and leaving the first major surface of the first device exposed, wherein the first layer is selected from the group consisting of an encapsulant and a polymer; forming a first dielectric layer over the first major surface of the first device, forming a via in the first dielectric layer, forming a seed layer within the via and over a portion of the first dielectric layer, physically coupling a connector to the seed layer, and plating a conductive material over the seed layer to form a first interconnect in the first via and over a portion of the first dielectric layer.

Title
Method of packaging a semiconductor device and a prefabricated connector
Application Number
12/510369
Publication Number
7655502 (B2)
Application Date
July 28, 2009
Publication Date
February 2, 2010
Inventor
Kenneth R Burch
Austin
TX, US
Marc A Mangrum
Manchaca
TX, US
Agent
Kim Marie Vo
James L Clingan Jr
Assignee
Freescale Semiconductor
TX, US
IPC
H01L 21/00
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