07641758 is referenced by 2 patents and cites 9 patents.

The present invention is a method for seaming a polyimide material. The method involves forming an interface between multiple the polyimide materials. Next, heat is applied to the interface to soften the polyimide material. The temperature of the heat source is below the melting point of the polyimide material. Finally, pressure is applied to the interface to create a seam between the polyimide materials.

Title
Method for thermal seaming of polyimides
Application Number
11/740267
Publication Number
7641758 (B2)
Application Date
April 25, 2007
Publication Date
January 5, 2010
Inventor
Garrett Poe
Madison
AL, US
Kevin Melton
Huntsville
AL, US
Timothy Wright
Huntsville
AL, US
Mark Johnson
Huntsville
AL, US
William Clayton
Huntsville
AL, US
Gregory Laue
Huntsville
AL, US
Agent
Bradley Arant Boult Cumming
Mark Swanson
David E Mixon
Assignee
NeXolve
AL, US
IPC
G03G 15/01
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