07625687 is referenced by 9 patents and cites 13 patents.

This invention pertains to a silsesquioxane resin with improved lithographic properties (such as etch-resistance, transparency, resolution, sensitivity, focus latitude, line edge roughness, and adhesion) suitable as a photoresist; a method for in-corporating the fluorinated or non-fluorinated functional groups onto silsesquioxane backbone. The silsesquioxane resins of this invention has the general structure (HSiO3/2)a(RSiO3/2)b wherein; R is an acid dissociable group, a has a value of 0.2 to 0.9 and b has a value of 0.1 to 0.8 and 0.9≦a+b≦1.0.

Title
Silsesquioxane resin
Application Number
10/555594
Publication Number
7625687 (B2)
Application Date
June 30, 2004
Publication Date
December 1, 2009
Inventor
David Lee Wyman
Midland
MI, US
Sheng Wang
Midland
MI, US
Eric Scott Moyer
Midland
MI, US
Sanlin Hu
Midland
MI, US
Agent
Sharon K Brady
Assignee
Dow Corning Corporation
MI, US
IPC
C08G 77/12
G03F 7/38
G03F 7/30
G03F 7/20
G03F 7/039
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