07622733 is referenced by 25 patents and cites 28 patents.

A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.

Title
Semiconductor structure with a plastic housing and separable carrier plate
Application Number
11/685005
Publication Number
7622733 (B2)
Application Date
March 12, 2007
Publication Date
November 24, 2009
Inventor
Carsten Von Koblinski
Villach
AT
Holger Woerner
Regensburg
DE
Thomas Kalin
Treffen
AT
Edward Fuergut
Dasing
DE
Agent
Edell Shapiro & Finnan
Assignee
Infineon Technologies
DE
IPC
H01L 29/40
H01L 23/52
H01L 23/48
H01L 51/00
H01L 35/24
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