07572681 is referenced by 63 patents and cites 429 patents.

A method of forming an embedded electronic component package includes coupling a substrate to a first dielectric layer, strip, or panel, and forming first electrically conductive vias and traces in the first dielectric layer. A cavity is then formed in the first dielectric layer and an electronic component is attached in the cavity. A second dielectric layer, strip, or panel, is then applied to the first dielectric layer, thereby encasing the electronic component in dielectric. Second via apertures are then formed through the second dielectric layer to expose selected electronic component bond pads and/or selected first electrically conductive vias and traces. The second via apertures are then filled with an electrically conductive material to form second electrically conductive vias electrically coupled to selected bond pads and selected first electrically conductive vias and traces.

Title
Embedded electronic component package
Application Number
11/298016
Publication Number
7572681 (B1)
Application Date
December 8, 2005
Publication Date
August 11, 2009
Inventor
David J Hiner
Chandler
AZ, US
Sukianto Rusli
Phoenix
AZ, US
Ronald Patrick Huemoeller
Chandler
AZ, US
Agent
Serge J Hodgson
Gunnison McKay & Hodgson L
Assignee
Amkor Technology
AZ, US
IPC
H01L 21/00
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