07566640 is referenced by 24 patents and cites 94 patents.

To provide a thin film integrated circuit which is mass produced at low cost, a method for manufacturing a thin film integrated circuit according to the invention includes the steps of: forming a peel-off layer over a substrate; forming a base film over the peel-off layer; forming a plurality of thin film integrated circuits over the base film; forming a groove at the boundary between the plurality of thin film integrated circuits; and introducing a gas or a liquid containing halogen fluoride into the groove, thereby removing the peel-off layer; thus, the plurality of thin film integrated circuits are separated from each other.

Title
Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact thin film integrated circuit device
Application Number
10/581674
Publication Number
7566640 (B2)
Application Date
December 14, 2004
Publication Date
July 28, 2009
Inventor
Kaori Ogita
Machida
JP
Kazue Hosoki
Atsugi
JP
Yurika Satou
Hiratsuka
JP
Miho Komori
Isehara
JP
Shunpei Yamazaki
Setagaya
JP
Agent
Robinson Intellectual Property Law Office P C
Eric J Robinson
Assignee
Semiconductor Energy Laboratory
JP
IPC
H01L 21/00
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