07555328 is referenced by 14 patents and cites 71 patents.

An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or “chip” on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensor may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor's electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.

Title
Implantable substrate sensor with back-to-back electrodes
Application Number
11/392163
Publication Number
7555328 (B2)
Application Date
March 29, 2006
Publication Date
June 30, 2009
Inventor
Lyle Dean Canfield
Sylmar
CA, US
Rajiv Shah
Rancho Palos Verdes
CA, US
John C Gord
Venice
CA, US
Charles L Byers
Canyon Country
CA, US
Joseph H Schulman
Santa Clarita
CA, US
Agent
Foley & Lardner
Assignee
Alfred E Mann Foundation for Scientific Research
CA, US
IPC
A61B 5/145
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