07545047 is referenced by 28 patents and cites 15 patents.

A semiconductor device with a wiring substrate as a stacking element for a semiconductor device stack is described herein. The wiring substrate includes a plastic frame of a first plastic compound and a central region of a second plastic compound. A semiconductor chip is embedded with its back side and its edge sides in the second plastic compound, the active upper side of the semiconductor device being in a coplanar area with the first and second plastic compounds.

Title
Semiconductor device with a wiring substrate and method for producing the same
Application Number
11/593150
Publication Number
7545047 (B2)
Application Date
November 6, 2006
Publication Date
June 9, 2009
Inventor
Holger Woerner
Regensburg
DE
Simon Jerebic
Regensburg
DE
Edward Fuergut
Dasing
DE
Michael Bauer
Nittendorf
DE
Agent
Edell Shapiro & Finnan
Assignee
Infineon Technologies
DE
IPC
H01L 29/40
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