07534652 is referenced by 6 patents and cites 12 patents.

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps and terminals may be formed on the bumps. The bumps may be of a precise height. The terminals lie at a precisely controlled height above the front surface of the wafer element. The terminals may include projecting posts which extend above a surrounding solder mask layer to facilitate engagement with a test fixture. The posts are immersed within solder joints when the structure is bonded to a circuit panel.

Title
Microelectronic elements with compliant terminal mountings and methods for making the same
Application Number
11/318846
Publication Number
7534652 (B2)
Application Date
December 27, 2005
Publication Date
May 19, 2009
Inventor
Jesse Burl Thompson
Brentwood
CA, US
Michael Warner
San Jose
CA, US
Craig S Mitchell
San Jose
CA, US
Ilyas Mohammed
Santa Clara
CA, US
Belgacem Haba
Saratoga
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 21/44
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