07525199 is referenced by 8 patents and cites 11 patents.

A plurality of integrated circuit packages are disposed on a substrate. The plurality of integrated circuit packages includes a first type of integrated circuit package that has an inactive side facing the substrate and an active side facing away from the substrate. The plurality of integrated circuit packages also includes a second type of integrated circuit package that has an inactive side facing away from the substrate and an active side facing the substrate. The first type of integrated circuit package and the second type of integrated circuit package are disposed such that a proximity communication enabled portion of the first type of integrated circuit package is aligned with a proximity communication enabled portion of the second type of integrated circuit package.

Title
Packaging for proximity communication positioned integrated circuits
Application Number
10/851835
Publication Number
7525199 (B1)
Application Date
May 21, 2004
Publication Date
April 28, 2009
Inventor
Robert J Drost
Mountain View
CA, US
Danny Cohen
Pacific Palisades
CA, US
Gary R Lauterbach
Los Altos Hills
CA, US
Agent
Osha • Liang
Assignee
Sun Microsystems
CA, US
IPC
H01L 23/48
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