In accordance with one example of the disclosed subject matter, a semiconductor device can include the following features. A first lead frame can be provided that has one end configured to form a recess. An LED chip can be mounted on an inner bottom surface of the recess. A bonding wire has one end connected to an electrode on the LED chip. A second lead frame has one end connected to the other end of the bonding wire. The LED chip and the bonding wire can be sealed in a sealing resin. The first lead frame and the second lead frame can protrude from the sealing resin and can be bent around to the bottom of the sealing resin. A groove formed through the center of the bottom of the sealing resin at least partly exposes an outer circumferential surface and an outer bottom surface of the recess from the sealing resin and into the groove.