07499288 is referenced by 23 patents and cites 13 patents.

In accordance with one example of the disclosed subject matter, a semiconductor device can include the following features. A first lead frame can be provided that has one end configured to form a recess. An LED chip can be mounted on an inner bottom surface of the recess. A bonding wire has one end connected to an electrode on the LED chip. A second lead frame has one end connected to the other end of the bonding wire. The LED chip and the bonding wire can be sealed in a sealing resin. The first lead frame and the second lead frame can protrude from the sealing resin and can be bent around to the bottom of the sealing resin. A groove formed through the center of the bottom of the sealing resin at least partly exposes an outer circumferential surface and an outer bottom surface of the recess from the sealing resin and into the groove.

Title
Surface mounting semiconductor device
Application Number
11/425578
Publication Number
7499288 (B2)
Application Date
June 21, 2006
Publication Date
March 3, 2009
Inventor
Shinichi Seki
Tokyo
JP
Kozo Tanaka
Tokyo
JP
Agent
Cermak Kenealy Vaidya & Nakajima
Assignee
Stanley Electric
JP
IPC
H05K 7/10
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