07482198 is referenced by 20 patents and cites 14 patents.

A method is described for producing through-contacts through a panel-shaped composite body including semiconductor chips and a plastic mass filled with conductive particles. The panel-shaped composite body is introduced between two high-voltage point electrodes. The point electrodes are oriented at positions at which through-contacts are to be introduced through the plastic mass. A high voltage is applied to the point electrodes thereby, forming the through-contacts through the plastic mass.

Title
Method for producing through-contacts and a semiconductor component with through-contacts
Application Number
11/586740
Publication Number
7482198 (B2)
Application Date
October 26, 2006
Publication Date
January 27, 2009
Inventor
Holger Woerner
Regensburg
DE
Simon Jerebic
Regensburg
DE
Edward Fuergut
Dasing
DE
Michael Bauer
Nittendorf
DE
Agent
Edell Shapiro & Finnan
Assignee
Infineon Technologies
DE
IPC
H01L 21/50
H01L 21/48
H01L 21/44
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