07473030 is referenced by 20 patents and cites 54 patents.

In thermal sensing devices, such as for calorimetry, a support layer or central layer can have a thermometer element or other thermal sensor on one side and a thermally conductive structure or component on the other. The thermally conductive structure can conduct temperature or other thermal input signals laterally across the support layer or central layer. The temperature or signals can then be provided to the thermometer element, such as by thermal contact through the support layer. An electrically conducting, thermally isolating anti-coupling layer, such as of gold or chromium, can reduce capacitive coupling between the thermally conductive structure and the thermometer element or other thermal sensor.

Title
Thermal sensing
Application Number
11/167746
Publication Number
7473030 (B2)
Application Date
June 27, 2005
Publication Date
January 6, 2009
Inventor
Michal V Wolkin
Los Altos
CA, US
Francisco E Torres
San Jose
CA, US
Dirk De Bruyker
Palo Alto
CA, US
Richard H Bruce
Los Altos
CA, US
Agent
James T Beran
Leading Edge Law Group
Assignee
Palo Alto Research Center Incorporated
CA, US
IPC
G01K 17/00
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