07470979 is referenced by 7 patents and cites 77 patents.

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providing a resin layer (14) as a stress relieving layer on the wafer (10), avoiding the electrodes (12); a step of forming a chromium layer (16) as wiring from electrodes (12) over the resin layer (14); a step of forming solder balls as external electrodes on the chromium layer (16) over the resin layer (14); and a step of cutting the wafer (10) into individual semiconductor chips; in the steps of forming the chromium layer (16) and solder balls, metal, thin film fabrication technology is used during the wafer process.

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
Application Number
Publication Number
7470979 (B2)
Application Date
December 30, 2005
Publication Date
December 30, 2008
Nobuaki Hashimoto
Oliff & Berridge
Seiko Epson Corporation
H01L 23/02
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