07470979 is referenced by 7 patents and cites 77 patents.

A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providing a resin layer (14) as a stress relieving layer on the wafer (10), avoiding the electrodes (12); a step of forming a chromium layer (16) as wiring from electrodes (12) over the resin layer (14); a step of forming solder balls as external electrodes on the chromium layer (16) over the resin layer (14); and a step of cutting the wafer (10) into individual semiconductor chips; in the steps of forming the chromium layer (16) and solder balls, metal, thin film fabrication technology is used during the wafer process.

Title
Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
Application Number
11/320583
Publication Number
7470979 (B2)
Application Date
December 30, 2005
Publication Date
December 30, 2008
Inventor
Nobuaki Hashimoto
Suwa
JP
Agent
Oliff & Berridge
Assignee
Seiko Epson Corporation
JP
IPC
H01L 23/02
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