07458878 is referenced by 6 patents and cites 25 patents.

The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of the portion of the face according to a control algorithm. This control algorithm can comprise determining a force applied to the work piece during the removing of the portion of the face, adjusting a feed rate of the first grind spindle when the force applied to the work piece has a predefined relationship with a first threshold level; and dressing a portion of the first grinding portion when the force applied to the work piece has a predefined relationship with a second threshold level that is greater than the first threshold.

Title
Grinding apparatus and method
Application Number
11/548213
Publication Number
7458878 (B2)
Application Date
October 10, 2006
Publication Date
December 2, 2008
Inventor
Salman Moudrek Kassir
Paso Robles
CA, US
Thomas A Walsh
Templeton
CA, US
Agent
Sinsheimer Juhnke Lebens & Mclvor
Thomas F Lebens
Assignee
Strasbaugh a California corporation
CA, US
IPC
B24B 1/00
B24B 51/00
B24B 49/00
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