07453157 is referenced by 33 patents and cites 33 patents.

A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of etched conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes an encapsulating mold material in contact with the microelectronic element and the compliant layer, whereby the encapsulating mold material overlies the outer region of the flexible substrate.

Title
Microelectronic packages and methods therefor
Application Number
11/140312
Publication Number
7453157 (B2)
Application Date
May 27, 2005
Publication Date
November 18, 2008
Inventor
Ilyas Mohammed
Santa Clara
CA, US
John B Riley III
Dallas
TX, US
Sridhar Krishnan
Campbell
CA, US
Yoichi Kubota
Pleasanton
CA, US
Teck Gyu Kang
San Jose
CA, US
Masud Beroz
Livermore
CA, US
Belgacem Haba
Cupertino
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 29/40
H01L 23/48
H01L 23/52
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