07449784 is referenced by 36 patents and cites 31 patents.

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

Title
Device package and methods for the fabrication and testing thereof
Application Number
11/590592
Publication Number
7449784 (B2)
Application Date
October 31, 2006
Publication Date
November 11, 2008
Inventor
John J Fisher
Blacksburg
VA, US
Larry J Rasnake
Blacksburg
VA, US
David W Sherrer
Radford
VA, US
Agent
Sherr & Vaughn PLLC
Assignee
Nuvotronics
VA, US
IPC
H01L 29/40
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