07427550 is referenced by 3 patents and cites 9 patents.

Methods of fabricating a passive element and a semiconductor device including the passive element are disclosed including the use of a dummy passive element. A dummy passive element is a passive element or wire which is added to the chip layout to aid in planarization but is not used in the active circuit. One embodiment of the method includes forming the passive element and a dummy passive element adjacent to the passive element; forming a dielectric layer over the passive element and the dummy passive element, wherein the dielectric layer is substantially planar between the passive element and the dummy passive element; and forming in the dielectric layer an interconnect to the passive element through the dielectric layer and a dummy interconnect portion overlapping at least a portion of the dummy passive element. The methods eliminate the need for planarizing.

Title
Methods of fabricating passive element without planarizing
Application Number
11/427457
Publication Number
7427550 (B2)
Application Date
June 29, 2006
Publication Date
September 23, 2008
Inventor
Kunal Vaed
Poughkeepsie
NY, US
Anthony K Stamper
Williston
VT, US
Jeffrey P Gambino
Westford
VT, US
Ebenezer E Eshun
Newburgh
NY, US
Timothy J Dalton
Ridgefield
CT, US
Anil K Chinthakindi
Wappingers Falls
NY, US
Agent
Hoffman Warnick & D Alessandro
Lisa U Jaklitsch
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 21/20
View Original Source