07420262 is referenced by 20 patents and cites 20 patents.

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semiconductor chip separated from such a semiconductor wafer constitutes an electronic component with external contacts in the form of edge contacts. Such an electronic component of semiconductor chip size can be used in diverse ways.

Title
Electronic component and semiconductor wafer, and method for producing the same
Application Number
10/789033
Publication Number
7420262 (B2)
Application Date
February 27, 2004
Publication Date
September 2, 2008
Inventor
Hermann Vilsmeier
Regensburg
DE
Markus Fink
Zell
DE
Thomas Bemmerl
Schwandorf
DE
Simon Jerebic
Regensburg
DE
Edward F├╝rgut
Dasing
DE
Gerald Ofner
Bad Abbach
DE
Peter Strobel
Regensburg
DE
Michael Bauer
Regensburg
DE
Agent
Dicke Billig Czaja PLLC
Assignee
Infineon Technologies
DE
IPC
H01L 21/66
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