07413929 is referenced by 44 patents and cites 35 patents.

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

Title
Integrated chip package structure using organic substrate and method of manufacturing the same
Application Number
10/55499
Publication Number
7413929 (B2)
Application Date
January 22, 2002
Publication Date
August 19, 2008
Inventor
Ching Cheng Huang
Hsinchu
TW
Mou Shiung Lin
Hsinchu
TW
Jin Yuan Lee
Hsinchu
TW
Agent
Winston Hsu
Assignee
MEGICA Corporation
TW
IPC
H01L 23/34
H01L 21/44
H01L 21/48
H01L 21/50
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