07394088 is referenced by 124 patents and cites 161 patents.

A memory device with improved heat transfer characteristics. The device first includes a dielectric material layer; first and second electrodes, vertically separated and having mutually opposed contact surfaces. A phase change memory element is encased within the dielectric material layer, including a phase-change layer positioned between and in electrical contact with the electrodes, wherein the lateral extent of the phase change layer is less than the lateral extent of the electrodes. An isolation material is positioned between the phase change layer and the dielectric layer, wherein the thermal conductivity of the isolation material is lower than the thermal conductivity of the dielectric material.

Title
Thermally contained/insulated phase change memory device and method (combined)
Application Number
11/338284
Publication Number
7394088 (B2)
Application Date
January 24, 2006
Publication Date
July 1, 2008
Inventor
Hsiang Lan Lung
Elmsford
NY, US
Agent
Haynes Beffel & Wolfeld
Assignee
Macronix International
TW
IPC
H01L 29/02
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