07393770 is referenced by 106 patents and cites 52 patents.

A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a substrate contact on the circuit side. The method also includes the steps of forming a substrate opening from the backside to the substrate contact, and then bonding the conductive interconnect to an inner surface of the substrate contact. A system for performing the method includes the semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the substrate contact. The semiconductor component can be used to form module components, underfilled components, stacked components, and image sensor semiconductor components.

Title
Backside method for fabricating semiconductor components with conductive interconnects
Application Number
11/133085
Publication Number
7393770 (B2)
Application Date
May 19, 2005
Publication Date
July 1, 2008
Inventor
David R Hembree
Boise
ID, US
William M Hiatt
Eagle
ID, US
Alan G Wood
Boise
ID, US
Agent
Stephen A Gratton
Assignee
Micron Technology
ID, US
IPC
H01L 21/44
H01L 21/30
H01L 21/76
H01L 21/00
H01L 23/02
H01L 29/40
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