07361993 is referenced by 11 patents and cites 6 patents.

Terminal pads and methods of fabricating terminal pads. The methods including forming a conductive diffusion barrier under a conductive pad in or overlapped by a passivation layer comprised of multiple dielectric layers including diffusion barrier layers. The methods including forming the terminal pads subtractively or by a damascene process.

Title
Terminal pad structures and methods of fabricating same
Application Number
10/908346
Publication Number
7361993 (B2)
Application Date
May 9, 2005
Publication Date
April 22, 2008
Inventor
Anthony K Stamper
Williston
VT, US
Robert M Rassel
Colchester
VT, US
Zhong Xiang He
Essex Junction
VT, US
Ebenezer E Eshun
Highland
NY, US
Daniel C Edelstein
White Plains
NY, US
Douglas D Coolbaugh
Highland
NY, US
Agent
Steven Capella
Schmeiser Olsen & Watts
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 29/40
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