07354800 is referenced by 60 patents and cites 14 patents.

An integrated circuit package system including providing a base substrate, attaching a base integrated circuit on the base substrate, attaching a core substrate over the base integrated circuit, attaching a substrate electrical connector between the core substrate and the base substrate, and applying an encapsulant having the core substrate partially exposed over the base integrated circuit.

Title
Method of fabricating a stacked integrated circuit package system
Application Number
11/380596
Publication Number
7354800 (B2)
Application Date
April 27, 2006
Publication Date
April 8, 2008
Inventor
Flynn Carson
Redwood City
CA, US
Agent
Mikio Ishimaru
Assignee
Stats Chippac
SG
IPC
H05K 7/00
H01L 23/02
H01L 21/00
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