07332068 cites 18 patents.

A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.

Title
Selective removal of dielectric materials and plating process using same
Application Number
10/856723
Publication Number
7332068 (B2)
Application Date
May 28, 2004
Publication Date
February 19, 2008
Inventor
Masud Beroz
Livermore
CA, US
Irina Poukhova
Fremont
CA, US
Belgacem Haba
Cupertino
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
C25F 3/00
View Original Source