07320928 is referenced by 140 patents and cites 39 patents.

Numerous embodiments of a stacked device filler and a method of formation are disclosed. In one embodiment, a method of forming a stacked device filler comprises forming a material layer between two or more substrates of a stacked device, and causing a reaction in at least a portion of the material, wherein the reaction may comprise polymerization, and the material layer may be one or a combination of materials, such as nonconductive polymer materials, for example.

Title
Method of forming a stacked device filler
Application Number
10/600203
Publication Number
7320928 (B2)
Application Date
June 20, 2003
Publication Date
January 22, 2008
Inventor
Shriram Ramanathan
Hillsboro
OR, US
David Staintes
Portland
OR, US
Grant M Kloster
Lake Oswego
OR, US
Agent
Blakely Sokoloff Taylor & Zafman
Assignee
Intel Corporation
CA, US
IPC
H01L 21/30
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