An integrated cutting system for a waste disposal device comprising a waste storage receptacle and a film cutting and sealing device. A cartridge containing a continuous length of film is positioned over the receptacle. The integrated cutting system further includes an activation mechanism operatively configured to alternatively engage a cutting device or a film sealing device capable of twistably sealing the film of the cartridge when the film is dispensed from the cartridge. A selection mechanism is arranged to control the activation mechanism to either engage the cutting device while deactivating the film sealing device, or to engage the film sealing device while deactivating the cutting device. The cutting device comprises a blade positioned to sever the film from the cartridge.