07312487 is referenced by 117 patents and cites 14 patents.

A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.

Title
Three dimensional integrated circuit
Application Number
10/919121
Publication Number
7312487 (B2)
Application Date
August 16, 2004
Publication Date
December 25, 2007
Inventor
Arifur Rahman
Freemont
CA, US
Mark A Lavin
Katonah
NY, US
David S Kung
Chappaqua
NY, US
Prabhakar N Kudva
New York
NY, US
Meikei Ieong
Wappingers Falls
NY, US
Kathryn W Guarini
Yorktown Heights
NY, US
Ibrahim M Elfadel
Ossining
NY, US
Syed M Alam
Cambridge
MA, US
Agent
Rafael Perez Piniero Esq
Louis J Percello Esq
Law Office of Charles W Peterson Jr
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 29/80
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