07309910 is referenced by 1 patents and cites 28 patents.

A microelectronic package includes a microelectronic element having contacts, a dielectric element, at least a portion of the dielectric element extending beneath the microelectronic element, and a structure including portions of a lead frame. The structure includes a plurality of terminals and leads formed integrally with the terminals, at least some of the terminals and at least some of the leads being disposed entirely beneath the microelectronic element, and at least some of the contacts being connected to at least some of the terminals by at least some of the leads. The leads and terminals are at least about 50 microns thick.

Title
Micro lead frame packages and methods of manufacturing the same
Application Number
11/647838
Publication Number
7309910 (B2)
Application Date
December 28, 2006
Publication Date
December 18, 2007
Inventor
Belgacem Haba
Saratoga
CA, US
Craig S Mitchell
San Jose
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 21/50
H01L 23/495
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