07297574 is referenced by 235 patents and cites 2 patents.

The present invention relates to a multi-chip device comprising a plurality of chip stacks each including a plurality of single chips stacked on each other, wherein the stacked single chips are electrically interconnected by one or more through-chip-connection extending through at least one of the single chips and a substrate providing one or more first contact elements each of which is in contact with one of the through-chip-connections and providing one or more second contact elements being in electrical contact with the first contact elements, wherein the plurality of chip stacks are stacked onto each other and wherein the second contact elements of one of the chip stacks each being arranged to be in contact to one or more third contact elements of an adjacent one of the chip stacks.

Title
Multi-chip device and method for producing a multi-chip device
Application Number
11/155277
Publication Number
7297574 (B2)
Application Date
June 17, 2005
Publication Date
November 20, 2007
Inventor
Olaf Schoenfeld
München
DE
Jochen Thomas
München
DE
Agent
Patterson & Sheridan L
Assignee
Infineon Technologies
DE
IPC
H01L 23/52
H01L 23/48
H01L 21/00
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