07276783 is referenced by 25 patents and cites 17 patents.

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

Title
Electronic component with a plastic package and method for production
Application Number
10/484443
Publication Number
7276783 (B2)
Application Date
July 31, 2002
Publication Date
October 2, 2007
Inventor
Holger Woerner
Regensburg
DE
Stefan Wein
Lappersdorf
DE
Josef Thumbs
Breitenbrunn
DE
Christian Stuempfl
Schwandorf
DE
Gerald Ofner
Bad Abbach
DE
Robert Christian Hagen
Sarching
DE
Bernd Goller
Otterfing
DE
Agent
Edell Shapiro & Finnan
Assignee
Infineon Technologies
DE
IPC
H01L 23/02
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