07268426 is referenced by 34 patents and cites 99 patents.

A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier.

Title
High-frequency chip packages
Application Number
10/783314
Publication Number
7268426 (B2)
Application Date
February 20, 2004
Publication Date
September 11, 2007
Inventor
Teck Gyu Kang
San Jose
CA, US
Masud Beroz
Livermore
CA, US
Glenn Urbish
Coral Springs
FL, US
Belgacem Haba
Cupertino
CA, US
Lee Smith
Chandler
AZ, US
Michael Warner
San Jose
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/34
H01L 23/10
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