07268304 is referenced by 2 patents and cites 7 patents.

A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.

Title
Microelectronic connection components having bondable wires
Application Number
11/111145
Publication Number
7268304 (B2)
Application Date
April 21, 2005
Publication Date
September 11, 2007
Inventor
Philip R Osborn
San Jose
CA, US
Fion Tan
San Jose
CA, US
Belgacem Haba
Cupertino
CA, US
Jae M Park
San Jose
CA, US
Masud Beroz
Livermore
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H05K 1/11
H05K 13/00
H01R 12/04
H01R 43/00
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