07259445 is referenced by 54 patents and cites 18 patents.

A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mold. For example, a package strip (10) may consist of a row (linear array) of groups of die attach areas (e.g. in a rectangular array of four). The heat spreader precursor (20) may accommodate one such group or multiple groups along the package strip (10). The package strip (10) may then be singulated to form the individual packages. Each singulated package includes a die (14), its associated substrate 16 (e.g., either a lead frame or interposer type substrate) and a portion of the heat spreader precursor (24) as a heat spreader (20).

Title
Thermal enhanced package for block mold assembly
Application Number
10/529017
Publication Number
7259445 (B2)
Application Date
September 23, 2003
Publication Date
August 21, 2007
Inventor
Edward L T Law
Chandler
AZ, US
Daniel K Lau
San Francisco
CA, US
Agent
Wiggin and Dana
Gregory S Rosenblatt
Assignee
Advanced Interconnect Technologies
MU
IPC
H01L 23/495
View Original Source