07232754 is referenced by 63 patents and cites 145 patents.

Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.

Title
Microelectronic devices and methods for forming interconnects in microelectronic devices
Application Number
10/879838
Publication Number
7232754 (B2)
Application Date
June 29, 2004
Publication Date
June 19, 2007
Inventor
William M Hiatt
Eagle
ID, US
Warren M Farnworth
Nampa
ID, US
Sidney B Rigg
Meridian
ID, US
David R Hembree
Boise
ID, US
Salman Akram
Boise
ID, US
Kyle K Kirby
Boise
ID, US
Agent
Perkins Coie
Assignee
Micron Technology
ID, US
IPC
H01L 21/44
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