07227761 is referenced by 25 patents and cites 17 patents.

A circuit board is mounted within a housing in a resilient manner to minimize the introduction of stresses warping the circuit board as the housing is warped or as a circuit board warped during its manufacture is mounted within the housing. The housing includes spaced apart mounting pads between which screw inserts extend as rigid columns through mounting holes within the circuit board. The surfaces of the mounting holes slide on the surfaces of the screw inserts, with the circuit board being resiliently held by resilient pads between its surfaces and the mounting pads.

Title
Apparatus for resiliently mounting a circuit board within a device housing
Application Number
10/963873
Publication Number
7227761 (B2)
Application Date
October 13, 2004
Publication Date
June 5, 2007
Inventor
Raymond Gary Octaviano II
Raleigh
NC, US
Larry Glenn Estes
Durham
NC, US
Agent
Carlos Munoz Bustamante
Ronald V Davidge
Assignee
Lenovo Singapore
SG
IPC
H05K 7/04
H05K 7/02
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