07224056 is referenced by 27 patents and cites 298 patents.

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.

Title
Back-face and edge interconnects for lidded package
Application Number
10/949844
Publication Number
7224056 (B2)
Application Date
September 24, 2004
Publication Date
May 29, 2007
Inventor
Craig S Mitchell
San Jose
CA, US
Michael Warner
San Jose
CA, US
David B Tuckerman
Orinda
CA, US
Giles Humpston
San Jose
CA, US
Belgacem Haba
Cupertino
CA, US
Robert Burtzlaff
Santa Clara
CA, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
Tessera
CA, US
IPC
H01L 23/12
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